Eetcher 1

This equipments etches metal foil surface (AL etc).
It roll transfers and etches continuously thin and very fragile material without damage and crimple with our original low tention technique.
¦Click to enlarge
yCharacteristicsz

ySpecificationz
Lane layout | 1Lane |
---|---|
Transfer speed | 5.0m^min |
Material width | MAX 310mm |
Material thickness | 20ƒÊm` |
Processed surface | One side or both side |
Process flow | Unwinder ` Etching ` Cleaning ` Drying ` Winder |
Utility | Electric poweri AC200E220V^50E60HZ jA DI water, City water, Cooling water, Scrubber, Heat exhaust, (Steam) |
Equipment size | 15miLj ~ 2miWj ~ 2.5miHj ¦Excluding touch panelEincidental facilities |
Etcher 2

This equipment transfer thin single substrate such as FPC by Roll to Roll and etches continuously.
Excellent accuracy control of detergent tempearture and pressure.
¦Click to enlarge
yChracteristicsz

ySpecificationz
Lane layout | 1Lane |
---|---|
Transfer speed | 1.5m^min |
Material width | MAX 350mm |
Material thickness | 50ƒÊm` |
surface to etch | Only one side |
Process flow | UnwinderiLoaderj` Laminate ` Etching ` Wet cleaning ` Acid cleaning ` Wet cleaning ` Winderisubstrate peelingj ` Wet cleaning ` Drying ` Substrate stacker |
Utility | Electric poweri AC200E220V^50E60HZ jA DI water, City water, CDA, Cooling water, Scrubber, Heat exhaust, (Steam) |
Equipment size | 10D0miLj ~ 3.0miWj ~ 3.0miHj ¦excluding touch panelEincidental facilities |